Resistant to moisture and electrostatic discharge, the moisture barrier is convenient for ESD-sensitive items, such as SMT. It protects contents from ESD charges and discharges and is a laminate of multiple layers of aluminized polyester, foil, and polyethylene. The film is heat sealable and suitable for vacuum packaging.
Resistant to moisture and electrostatic discharge, the moisture barrier is convenient for ESD-sensitive items, such as SMT. It protects contents from ESD charges and discharges and is a laminate of multiple layers of aluminized polyester, foil, and polyethylene. The film is heat sealable and suitable for vacuum packaging.
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The Dri-Shield moisture barrier film is designed for dry packing of moisture sensitive devices and to protect contents from damage due to ESD events or EMI.
Features
| Physical Properties | |
| Moisture Vapor Transmission Rate (MVTR) | < 0.0003 grams/100 sq. in./24 hrs, ASTM F1249 < 0.00035 grams/100 sq. in./24 hrs, ASTM F392 condition E and ASTM F2149 |
| Tensile Strength | 9900 PSI, 68 MPa, ASTM D882 |
| Puncture Resistance | 25 lbs, 111 N, MIL-STD-3010C Method 2065 |
| Thickness | 4.2 mils, 0.1067 mm ±10%, MIL-STD-3010 Method 1003 |
| Marking Adhesion | Pass, IPC-TM-650 2.4.1 |
| Electrical Properties | |
| ESD Shielding | <10 nJ ANSI/ESD STM11.31 |
| Surface Resistance | Interior: 1 x 104 to < 1 x 1011 ohms, ANSI/ESD STM11.11 Exterior: 1 x 104 to < 1 x 1011 ohms, ANSI/ESD STM11.11 |
| EMI Attenuation | 45 dB, 1 to 10 GHz |
| Cleanliness | |
| Silicone | Not detected, FTIR |
| Heat Sealing Conditions | |
| Temperature | 400°F (204°C) |
| Time | 0.6 to 4.5 seconds |
| Pressure | 30 to 70 PSI, 206 to 482 KPa |
| Physical Properties | |
| Moisture Vapor Transmission Rate (MVTR) | < 0.0003 grams/100 sq. in./24 hrs, ASTM F1249 < 0.00035 grams/100 sq. in./24 hrs, ASTM F392 condition E and ASTM F2149 |
| Tensile Strength | 9900 PSI, 68 MPa, ASTM D882 |
| Puncture Resistance | 25 lbs, 111 N, MIL-STD-3010C Method 2065 |
| Thickness | 4.2 mils, 0.1067 mm ±10%, MIL-STD-3010 Method 1003 |
| Marking Adhesion | Pass, IPC-TM-650 2.4.1 |
| Electrical Properties | |
| ESD Shielding | <10 nJ ANSI/ESD STM11.31 |
| Surface Resistance | Interior: 1 x 104 to < 1 x 1011 ohms, ANSI/ESD STM11.11 Exterior: 1 x 104 to < 1 x 1011 ohms, ANSI/ESD STM11.11 |
| EMI Attenuation | 45 dB, 1 to 10 GHz |
| Cleanliness | |
| Silicone | Not detected, FTIR |
| Heat Sealing Conditions | |
| Temperature | 400°F (204°C) |
| Time | 0.6 to 4.5 seconds |
| Pressure | 30 to 70 PSI, 206 to 482 KPa |
