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Resistant to moisture and electrostatic discharge, the moisture barrier is convenient for ESD-sensitive items, such as SMT. It protects its contents from ESD charges and discharges, and is a laminate of multiple layers of aluminized polyester and polyethylene.
Resistant to moisture and electrostatic discharge, the moisture barrier is convenient for ESD-sensitive items, such as SMT. It protects its contents from ESD charges and discharges, and is a laminate of multiple layers of aluminized polyester and polyethylene.
Discontinued!
This product has been discontinued and is no longer available. There are no replacement options.
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The Dri-Shield moisture barrier film is designed for dry packing of moisture sensitive devices and to protect contents from damage due to ESD events or EMI.
Features
| Physical Properties | |
| Moisture Vapor Transmission Rate (MVTR) | < 0.0003 grams/100 sq. in./24 hrs, ASTM F1249 < 0.00035 grams/100 sq. in./24 hrs, ASTM F392 condition E and ASTM F2149 |
| Tensile Strength | 9900 PSI, 68 MPa, ASTM D882 |
| Puncture Resistance | 25 lbs, 111 N, MIL-STD-3010C Method 2065 |
| Thickness | 4.2 mils, 0.1067 mm ±10%, MIL-STD-3010 Method 1003 |
| Marking Adhesion | Pass, IPC-TM-650 2.4.1 |
| Electrical Properties | |
| ESD Shielding | <10 nJ ANSI/ESD STM11.31 |
| Surface Resistance | Interior: 1 x 104 to < 1 x 1011 ohms, ANSI/ESD STM11.11 Exterior: 1 x 104 to < 1 x 1011 ohms, ANSI/ESD STM11.11 |
| EMI Attenuation | 45 dB, 1 to 10 GHz |
| Cleanliness | |
| Silicone | Not detected, FTIR |
| Heat Sealing Conditions | |
| Temperature | 400°F (204°C) |
| Time | 0.6 to 4.5 seconds |
| Pressure | 30 to 70 PSI, 206 to 482 KPa |
| Physical Properties | |
| Moisture Vapor Transmission Rate (MVTR) | < 0.0003 grams/100 sq. in./24 hrs, ASTM F1249 < 0.00035 grams/100 sq. in./24 hrs, ASTM F392 condition E and ASTM F2149 |
| Tensile Strength | 9900 PSI, 68 MPa, ASTM D882 |
| Puncture Resistance | 25 lbs, 111 N, MIL-STD-3010C Method 2065 |
| Thickness | 4.2 mils, 0.1067 mm ±10%, MIL-STD-3010 Method 1003 |
| Marking Adhesion | Pass, IPC-TM-650 2.4.1 |
| Electrical Properties | |
| ESD Shielding | <10 nJ ANSI/ESD STM11.31 |
| Surface Resistance | Interior: 1 x 104 to < 1 x 1011 ohms, ANSI/ESD STM11.11 Exterior: 1 x 104 to < 1 x 1011 ohms, ANSI/ESD STM11.11 |
| EMI Attenuation | 45 dB, 1 to 10 GHz |
| Cleanliness | |
| Silicone | Not detected, FTIR |
| Heat Sealing Conditions | |
| Temperature | 400°F (204°C) |
| Time | 0.6 to 4.5 seconds |
| Pressure | 30 to 70 PSI, 206 to 482 KPa |
